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AdvancedTCA, Dual Socket CPU Blade with Intel® Xeon® E5-2600 v2 Series Processors, Dual-Dual 40G Fabric Interface and Acceleration Support
  • Two 8-Core Intel® Xeon® E5-2600 v2 Series processors
  • Intel® Communications Chipset 89xx Series
  • Eight DDR3 VLP DIMMs with ECC support
  • Up to four 40GBaseKR4 ports on Fabric interface to support Dual-Dual Star Topology
  • Other fabric configurations supported via two Fabric Mezzanine sites (type I)
  • Two 10/100/1000BASE-T front panel ports
  • One Fabric Mezzanine Module (type II) for optional front IO or additional acceleration
  • Fully managed, hot swappable RTM with 36 PCIe gen.3 lanes
Advantech’s MIC-5333 is a 40G dual processor ATCA blade based on the Intel platform for communications infrastructure. It enables the highest network and packet processing performance available in ATCA form factor with up to 20 cores and 32 threads of processing power, scalable offload based on Intel QuickAssist technology and support for up to four 40G fabric ports. Fast PCI Express gen. 3 technology running at up to 8Gbps per lane and best in class virtualization support combined with superior thermal design make it ideal for high performance applications and workload consolidation on Intel architecture.

Two QPI interfaces between the CPUs improve memory and I/O access throughput and latencies when one processor needs to access resources hosted by the other socket. With four DDR3 DIMMs per socket in a quad channel design running up to 1600MT/s, the MIC-5333 not only offers superior memory bandwidth over 3-channel designs, but can also support memory densities up 256GB using latest LR DIMM technology. It outperforms previous generation dual socket designs while keeping similar thermal characteristics with balanced airflow resistance.
Please refer to :
Related whitepaper-1:Fabric Mezzanine Modules Push IA Blade to 160Gbps on ATCA
Related whitepaper-2:Fabric Mezzanine Modules bring unprecedented I/O and acceleration flexibility to Intel Xeon ATCA Blades

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