3U OpenVPX CPU Blade with Intel® Xeon® E3v5 and 6th Generation Core® Processor
- Intel® Xeon® E3v5 and 6th Generation Core® Processor
- Intel® CM236 PCH
- Multiple display support
- OpenVPX MOD3-PAY-2F2U-16.2.3-3 profile compliant
- Onboard 16GB DDR4-2133 with ECC support
- Configurable PCIE x8 ports on Data Plane
- Four 1000BASE-T ports on Control Plane (two configurable to SERDES)
- Optional I/O module for front panel access
- Onboard flash storage device
Based on the Intel® 6th Generation Core® and Xeon® E3 L v5 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (from one port to four ports) of PCI Express gen.3 via the backplane to the highest performance mainstream peripherals and I/O cards,, and vast I/O functions for extended interconnectivity and controllability.
The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by Intel’s integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands.
With the standard conduction-cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability.
The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 3rd, 4th UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.