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- DDR4 2666Mhz SO-DIMM / UDIMM with ECC
- 30μ" gold plating thickness
- Anti-sulfuration resistor
- Serial presence detect with EEPROM
- Support ECC error detection and correction
- 100% tested for stability, compatibility and performance
- Samsung original chip
Product Specifications Download Spec
- Part Number
- Details
-
AQD-SD4U8GE26-SE
- Manufacturer
- Capacity
- Chip Manufacturer
- Chip Organization
- Rank
- Interface
- Frequency
- Voltage
- PCB Height
- Feature
- Operating Temperature
- Advantech
- 8 GB
- SAMSUNG
- 1G X 8
- 1 Rank
- 260 pin
- 2666 Mhz
- 1.2 V
- 1.18"
- ECC
- 0 ~ 85°C (32 ~ 185°F)
Memory
-
Manufacturer
AQD-SD4U8GE26-SE Advantech -
Capacity
AQD-SD4U8GE26-SE 8 GB -
Chip Manufacturer
AQD-SD4U8GE26-SE SAMSUNG -
Chip Organization
AQD-SD4U8GE26-SE 1G X 8 -
Rank
AQD-SD4U8GE26-SE 1 Rank -
Interface
AQD-SD4U8GE26-SE 260 pin -
Frequency
AQD-SD4U8GE26-SE 2666 Mhz -
Voltage
AQD-SD4U8GE26-SE 1.2 V -
PCB Height
AQD-SD4U8GE26-SE 1.18" -
Feature
AQD-SD4U8GE26-SE ECC -
Operating Temperature
AQD-SD4U8GE26-SE 0 ~ 85°C (32 ~ 185°F)
