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Empowering Development and Production—Introducing Advantech’s EPC-R7300 Industrial Barebone PC for NVIDIA Jetson Orin NX and Orin Nano

05/01/2023
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Advantech EPC-R7300 edge ai system with NVIDIA Jetson Orin NX and Orin Nano

Taipei, Taiwan, January 2023 — Advantech, a leading industrial embedded AI solution provider, is proud to announce the release of their EPC-R7300, an industrial barebone PC for NVIDIA® Jetson Orin™ NX, and Orin Nano systems on modules. Leveraging powerful NVIDIA Jetson Orin modules, the EPC-R7300 can deliver 20­–100 TOPS of AI performance with unparalleled low power consumption (5 ~ 25 watts). For easy AI deployment, the EPC-R7300 features an ultra-compact form factor (152×173×50 mm) with diverse rear I/O configuration options, delivering excellent flexibility and computing performance for next-generation robotics, surveillance, and other applications using edge inference.

A Highly Reliable Single AI Kit for NVIDIA Jetson Orin NX and Orin Nano

Advantech’s EPC-R7300 industrial-grade barebone PC is equipped with a production carrier board and mainstream I/O functions including RS-485, CAN bus, and multiple Ethernet ports — fully compatible with NVIDIA Jetson Orin NX and Orin Nano modules — satisfying various computing needs of developers. The EPC-R7300 will be supported by NVIDIA JetPack 5.1TM, making it easy to migrate from the NVIDIA development kit to our barebone PC or between different Jetson Orin modules. It will also help AI developers automatically actuate I/Os without further driver installation or configuration. Edge AI applications — including image inferencing — require premium-quality camera inputs. Accordingly, the EPC-R7300 provides USB, IP, and MIPI-CSI camera interfaces for intelligent vision-based systems. It also features 1 x HDMI 2.0 port for 4K resolution displays, 2 x GbE LAN for data connectivity, 2 x USB 3.2 Gen 1 ports, and 3 x M.2 slots for wireless modules and storage expansion (1 x 2230 E-Key for Wi-Fi 6 and Bluetooth, 1 x 3042/52 B-Key for 4G/5G, and 1 x 2280 M-Key for NVMe SSD).

In terms of ruggedness, Advantech’s EPC-R7300 can tolerate a wide range of operating temperatures and power inputs and has a high vibration tolerance (-40 ~ 85 ºC / -40 ~ 185 ºF; 9 ~ 36 VDC; 3.0 Grms). This, in turn, helps users produce field-side prototypes while significantly reducing the development time and resources required for system integration, verification, and transformation into a ready-to-use edge AI system.

Diverse Rear I/O Configurations Accommodate a Myriad of Application Requirements

Designed to fulfil different application requirements in one kit, the EPC-R7300 provides up to 5 rear I/O configurations, including serial ports (RS-232, RS-485), isolated DIOs, USB 2.0, and a 4-port GbE hub to enable system capacity expansion. The I/O peripheral drivers are all integrated into the board support package (BSP) with JetPack 5.1, making the EPC-R7300 capable of delivering excellent functionality without additional integration work. 

1 x RS-485, 1 x RS-232, 

1 x 4 DIs & 4 DOs

1 x GbE, 2 x USB2.0, 2 x RS-232

1 x CAN bus, 2 x RS-232

4 x GbE

 

4 x GbE (3 x LAN, 1 x WAN)

  

ROS2 Suite — Ready for Robotics Development and Integration

The Jetson-based platform is supported by the ROS2 Suite, a coordinated and proven software package built on Advantech’s AIM-Linux embedded software and designed to support Robot Operating System (ROS) environments. The ROS2 Suite utilizes the SUSI API. SUSI is a suite of application interfaces that enables users to monitor and control digital I/O, I2C, and watchdog timers directly. Industry protocols and edge time-series database software are also implemented for ROS industrial applications. Furthermore, general ROS utilities such as RVIZ and MoveIt are pre-integrated to shorten application development time. The AI Accelerator SDKs from NVIDIA are consolidated into the ROS2 Suite to increase edge intelligence efficiency from graphics processing units inside the processor. With high software integration, the EPC-R7300 significantly reduces the time and resources required for robotics development.

Advantech’s EPC-R7300 samples will be ready in Q1 2023. For more information about this and other EPC-R Jetson-based AI solutions, please contact the Advantech sales team, authorized distributors, or visit the EPC-R7300 product page for more detials.



EPC-R7300

  • Industrial fanless Barebones PC with dimension of 152 × 173 × 50 mm 
  • Compatible with NVIDIA Jetson Orin NX and Jetson Orin Nano 
  • NVIDIA JetPack 5.1 support  
  • 5 rear I/O configurations available for different requirements 
  • Rugged barebones PC chassis supports wide operating temperature range, wide power input range and vibration tolerance (-40~85ºC; -40~185ºF/ 9~36VDC/ 3.0Grms) 
  • The ROS2 Suite supports robotics development