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Advantech’s COMe Mini Type 10, SOM-7583 —— 11th Gen. Intel® Core™ Processors in the Size of a Business Card

3/2/2021
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Taipei, Taiwan, March, 2021 – Advantech, a global embedded IoT market leader, launches SOM-7583, an innovative COMe mini Type 10 module with the latest 11th Gen. Intel® Core™ processors with up to 4-cores Core i7 for a myriad of high performance applications. This tiny, but mighty module features on-board LPDDR4 memory and NVMe SSD. It supports multiple I/O and displays, including 2.5 GbE LAN supporting TSN, 1x PCIe Gen 3 x4, 2x USB 3.2 Gen 2 (10Gbps), 2x SATA Gen3, and 2x independent 4K displays. Meanwhile, this platform is known for its AI Acceleration with Intel® Deep Learning Boost engine, VNNI, which can improve the efficiency and increase the inferencing performance dramatically. To help partners to accelerate the AI revolution, Advantech will offer Edge AI Suite software, Intel OpenVINO toolkit based on the demand. The SOM-7583 is an excellent solution for applications that are requiring powerful computing in a compact design, such as aerospace, defense, industrial control, and transportation.

Ultimate Computing Performance Coming with Fan-less Thermal Solution

Despite being smaller than a business card, the SOM-7583 yields 40% higher CPU performance, 60% better graphics and 5X AI performance than its previous generation. It integrates with LPDDR4X 4266Mt/s IBECC RAM, up to 16GB and on-board NVMe SSD which achieves a 10 fold increase in the sequential reading and writing speed compared with eMMC 5.1. With the above enhanced performance, Advantech is also excited to introduce the leading fan-less thermal solution, designed to dissipate heat and keep the system running under TDP 15W at 60°C ambient temperature. With total height at only 27mm, the thermal module comes with a copper block to directly contact CPU, then transfers the heat to the ambient via heat pipes soldered with stacked fins.

High Speed I/O for Efficient Data Transmission

The SOM-7583 features USB 3.2 Gen 2 (10GT/s) and PCIe Gen 3 (8.0GT/s), which are considerably faster than the previous COMe mini solutions. It is designed to enable low-latency networking performance in factory automation applications via 2.5 GbE LAN with TSN. This solution improves the precision of data synchronization over the network, and minimizes jitter to reduce latency during real time device communication. Similarly, the SOM-7583 enables USB4 compliance via its carrier board design. Advantech offers a reference design to help partners integrate USB-C to the carrier board yielding a solution uniquely applicable to portable devices, test equipment, and defense applications.

Robust Reliability for Harsh Environments 

Besides its high performance and speedy I/O, the SOM-7583 is a rugged product designed to enhance the product reliability. With all key components on board, it is an ideal anti-vibration solution for transportation applications. Additionally, it supports a wide range power input (8.5 ~ 20V) and extended temperature SKU (-40 ~ 85 °C /-40 ~ 185 °F) capable of enduring applications in harsh environments such as aerospace and other outdoor applications.

Key Features

  • COMe Mini Type-10 with Intel® 11th Gen. Core™ processors
  • 16GB LPDDR4X 4266MT/s and IBECC support
  • Fanless thermal module to withstand TDP 15W under 60C ambient temperature
  • USB4 Compliance supported by carrier board design
  • NVMe SSD on board
  • Operating temp.: Standard 0 ~ 60 °C (32 ~140 °F) or Extended -40 ~ 85 °C (-40 ~ 185 °F)