Trusted by Global Top 3 Semiconductor AI Memory Leader for HBM
31/03/2025
HBM provides significantly greater bandwidth than traditional DRAM for handling demanding workloads, low power consumption for energy-efficient performance, and a vertical stacking design to fit space-constrained applications such as GPUs and AI accelerators.
Challenges / Requirements:
The HBM bonding machine, used for GPUs faced several key challenges:
- Space Limitation: The system had to fit within strict size constraints.
- Excessive maintenance: Frequent validation testing led to time-consuming and resource-intensive.
- Performance Limits Causing Delays & Inaccuray:Insufficient processing power led to slow data handling and inaccurate transmission, affecting efficiency and reliability.
Solution:
System1. HBM Controller
- IPC-6025: 5-slot desktop wallmount chassis
- PCE-5133: Intel 14th Generation Core i single board computer
- PCE-5B05-02: Excellent expandability for machine integration
System2. HBM Vision System
- IPC-7120: Wallmount Chassis with front I/O Interfaces for ATX/mATX motherboard
- AIMB-788: LGA1700 12th/13th/14th generation Intel® Core™ i9/i7/i5/i3 ATX motherboard
- RTX 4000 Ada: NVIDIA Ada Lovelace GPU architecture, featuring 6,144 CUDA cores and 20 GB GDDR6 memory with ECC
- PCIE-1164-AE: Frame grabber with CoaxPress interface, supports up to 4 CXP-12 cameras
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Benefits:
- Space Efficiency: Compact design significantly optimizes space-saving
- Long Lifecycle: 10 years+ longevity and revision control
- High Performance: Delivering up to 1.34x faster multi-thread performance, enhanced memory bandwidth with DDR5 support
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