This design guide is intended to help chassis vendors and systems integrators in developing I/O shield solutions based on Intel ATX and microATX form factor motherboards. The guide shows several core designs of connector position layouts but does not provide design details. The designs are intended to be used as reference.
The ATX specification (V2.01, February 1996) and the microATX specification (V1.0, December 1997) describe a back panel I/O aperture, within which any number of different I/O connector configurations may be offered. Toward the back of the chassis, the specifications define a stacked I/O area that is 6.25 inches (158.75mm) wide by 1.75 inches (44.45mm) tall. This area allows the use of stacked connectors on the motherboard to maximize the amount of I/O space available.
To download copies of the following related documents, visit the Web sites listed below:
* ATX Specification, V2.01 (see http://www.teleport.com/~atx)
* microATX Motherboard Interface Specification, V1.0 (see http://www.teleport.com/~microatx)
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