Системы на модуле

Product Categories

• COM-HPC

  A new module standard with next level CPUs, more memories, and next generation high-speed I/Os like PCIe Gen5 (32GT/s), USB4 (40Gbps), and 25GbE

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  • Server

    COM-HPC Server has D/E two sizes with IPMB remote control ability and next generation high-speed I/O like PCIe Gen5 (32GT/s), USB4 (40Gbps), and 25GbE

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  • Client

    COM-HPC Client has A/B/C three sizes with 3 DDI, 1 eDP, 2 Soundwire, and next gen. high-speed I/O like PCIe Gen5 (32GT/s), USB4 (40Gbps), and 25GbE

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• COM Express Basic

  COM Express Basic is euipped with the latest processor. It can provides not only high-speed interfaces like HDMI/DisplayPort, PCI Express, SATA and USB 3.0 for volume data transportation, but also LVDS, PCI and IDE for legacy applications. COM Express Basic Module is equipped with high-end processor in a board size of 125mm x 95mm.

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  • Type 7

    COM Express Basic Type 7

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  • Type 6

    COM Express Basic Type 6

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  • COM Express Basic Type 2

    COM Express Basic Type 2

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• COM Express Compact

  COM-Express Compact is compact module that includes Intel Core i ULT 9th Generation, Intel Atom processor, which the best solution for mobile applications.

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  • High Computing Performance

    COM Express Compact Module is equipped with low-power processor in a board size of 95mm x 95mm. Type 6 provides DDI display interface, HDA, super speed I/Os and high bandwidth expansion interfaces such as USB3.0, SATAIII and PCIe gen3. It offers a balance performance with low power consumption.

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  • Entry Computing Performance

    COM Express Compact Module is equipped with low-power processor in a board size of 95mm x 95mm. Type 6 provides DDI display interface, HDA, super speed I/Os and high bandwidth expansion interfaces such as USB3.0, SATAIII and PCIe gen3. It offers a balance performance with low power consumption.

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• COM Express Mini

  COM Express Mini Module is equipped with Entry processor in a board size of 84mm x 55mm and Intel Atom. It supports memory down and onboard storage for ruggedized applications.

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  • Type 10

    COM Express Mini Module is equipped with Entry processor in a�board size of�84mm�x 55mm.�It supports memory�down and onboard storage for ruggedized applications.�Type 10 provides�DDI display and�eDP/LVDS interface; high speed I/Os�such as USB3.0, SATAIII and�PCIe.

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• SMARC

  SMARC is a small form factor that connects to carrier board by golden finger. It supports low power and wide range computing performance in two module size (82x50mm/82x80mm); also comes with onboard memory & storage. Advantech SMARC is integrated dual LAN and wireless technology on module.

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• Qseven

  In ultra-small form factor and Intel Atom, Qseven can deal with low power processors with on-board memory and storage. Qseven module transfers all the major signals and interface to the carrier board via golden fingers at the PCB edge.

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• ETX/XTX

  ETX / XTX CPU module eqiupped with Intel Atom has great I/O capacity and meets both ISA and PCI needs, while supporting the Computer On Module concept for plug-in CPU modules. Advantech is a founding member of the ETX Industrial Group (ETX-IG).

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• Development Board

  Advantech Development boards provide a schematic software & reference design to reduce efforts needed in development stage. Advantech Development Board can be used to test carrier board problems and support COM series, RTX, SMARC, Qseven, and ETX / XTX form factors.

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• Application Board

  Advantech Application Board is application-oriented development board which provides a schematic reference to reduce design effort at the development stage.

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• Evaluation Kit

  Advantech Computer-On-Module evaluation kits allow quick application deployment and minimizes development effort.

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• ITM-3 Series

  ITM-3, Industrial Thermal Module, supports COMe standard cooler & QFCS. By improving board heat dissipation, it enables superior computing performance