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ARM-based Platforms

TPC-215W

15.6" FHD Touch Panel Computer with Qualcomm® QCS6490 Octa-Core Kryo™ 670 Processor, 12 TOPS AI NPU, built-in 8G DDR5 RAM

  • Powered by Qualcomm® QCS6490 with Kryo™ 670 Octa-Core CPU and 12 TOPS AI NPU for real-time on-device inference
  • Supports Windows 11 IoT Enterprise LTSC, Linux Yocto, and Android for flexible software deployment
  • IP66-rated, -10°C to 50°C wide operating temperature, and 10G shock resistance for continuous industrial operation
  • 12W TDP with on-board 8GB DDR5 RAM and 128GB UFS storage for compact, low-power edge computing
  • Rich I/O with 2x GbE RJ45, 2x USB 3.0 Type-A, RS-232/422/485 and RS-485/CAN 2.0B serial ports, plus optional M.2 Wi-Fi/BT and 5G expansion
  • Capacitive touchscreen with 1.8mm cover glass for smooth, precise interaction
  • Panel or VESA mounting for versatile installation across industrial sites
  • 24VDC ±20% power supply designed for reliable factory-floor deployment

Certifications:

Support Links:

Datasheet Tải Tài Liệu Kỹ Thuật
  • 15.6" FHD Touch Panel Computer with Qualcomm® QCS6490 Octa-Core Kryo™ 670 Processor, 12 TOPS AI NPU, built-in 8G DDR5 RAM

Specifications

LCD Display
Viewing Angle (H/V°)
  • 178/178
  • 178/178
Luminance (cd/m2)
  • 500
  • 500
Max. Resolution
  • 1920 x 1080
  • 1920 x 1080
Display Size
  • 15.6"
  • 15.6"
Backlight Life (hrs)
  • 50,000
  • 50,000
Touchscreen
Touch Type
  • PCAP
  • PCAP
Hardware
CPU
  • Qualcomm® QCS6490 8x Kryo™ 670 CPU from 1.9 up to 2.7 GHz
  • Qualcomm® QCS6490 8x Kryo™ 670 CPU from 1.9 up to 2.7 GHz
Memory
  • 1 x Onboard Memory with 8 GB LPDDR5
  • 1 x Onboard Memory with 8 GB LPDDR5
Storage
  • 1 x Onboard UFS (128 GB)
  • 1 x Onboard UFS (128 GB)
Expansion
  • 1 x M.2 B key 3052, 1 x M.2 E key 2230
  • 1 x M.2 B key 3052, 1 x M.2 E key 2230
I/O
  • 2 x USB 3.0 Type C, 2 x USB 3.0 Type A
  • 2 x USB 3.0 Type C, 2 x USB 3.0 Type A
Certification
  • CE, FCC Class A, CB, UL, BSMI
  • CE, FCC Class A, CB, UL, BSMI
Hardware Security
  • TPM 2.0
  • TPM 2.0
OS Support
  • Microsoft Window 11 LTSC, Linux
  • Microsoft Window 11 LTSC, Linux
Power Input
  • 24 VDC ±10%
  • 24 VDC ±10%
I/O Interface
Power Connector
  • 1 x Phoenix Jack
  • 1 x Phoenix Jack
LAN Ports
  • 2 x 10/100/1000 Mbps
  • 2 x 10/100/1000 Mbps
Serial Ports
  • 1xRS-232/422/485,1xRS-485/Canbus
  • 1xRS-232/422/485,1xRS-485/Canbus
Mechanical
Mounting
  • VESA, Panel
  • VESA, Panel
Enclosure
  • Die cast magnesium alloy, Die-casting aluminum
  • Die cast magnesium alloy, Die-casting aluminum
Weight (Net)
  • 6 kg (13.22 lb)
  • 6 kg (13.22 lb)
Environment
Relative Humidity
  • 95% RH (non-condensing)
  • 95% RH (non-condensing)
Ingress Protection
  • Front Panel IP66
  • Front Panel IP66
Vibration Protection
  • 2 Grms, random
  • 2 Grms, random
Shock Protection
  • 10 G, half sine
  • 10 G, half sine
Operating Temperature
  • -10~50 °C (14~122 °F)
  • -10~50 °C (14~122 °F)
Storage Temperature
  • -20~60 °C (-4~140 °F)
  • -20~60 °C (-4~140 °F)

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