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New
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/AQD-D4U8GN32-SE-back20200929203437.jpg)
/AQD-D4U8GN32-SE-front20200929203432.jpg)
- 8GB
- DDR 4 3200MHz
- 30u" Gold Plating Thickness
- Anti-sulfurization resistance
- Unbuffered
Product Specifications Download Spec
- Part Number
- Details
-
AQD-D4U8GN32-SE
- Manufacturer
- Capacity
- Chip Manufacturer
- Chip Organization
- Rank
- Interface
- Frequency
- Voltage
- PCB Height
- Feature
- Operating Temperature
- Advantech
- 8 GB
- SAMSUNG
- 1 G x 8
- 1 Rank
- 288 pin
- 3200 Mhz
- 1.2 V
- 1.23"
- Unbuffered
- 0 ~ 85°C (32 ~ 185°F)
Memory
-
Manufacturer
AQD-D4U8GN32-SE Advantech -
Capacity
AQD-D4U8GN32-SE 8 GB -
Chip Manufacturer
AQD-D4U8GN32-SE SAMSUNG -
Chip Organization
AQD-D4U8GN32-SE 1 G x 8 -
Rank
AQD-D4U8GN32-SE 1 Rank -
Interface
AQD-D4U8GN32-SE 288 pin -
Frequency
AQD-D4U8GN32-SE 3200 Mhz -
Voltage
AQD-D4U8GN32-SE 1.2 V -
PCB Height
AQD-D4U8GN32-SE 1.23" -
Feature
AQD-D4U8GN32-SE Unbuffered -
Operating Temperature
AQD-D4U8GN32-SE 0 ~ 85°C (32 ~ 185°F)
