Introduction
In manual electronics manufacturing processes that require the application of adhesives, it generally takes double the effort to complete in comparison to when automated dispensers are used. When traditional adhesive dispensers are used, the process involves using contact-type dispensers to apply adhesives to such surfaces as electronic components and LED packaging.
However, with the miniaturization of products, these traditional dispensers can no longer be used. High-speed automated adhesive dispensers that provide accurate flow control as well as high-precision and contactless application are instead required for the forming of often micro-sized points, lines, and other shapes.
System Requirements
System Description
Project Implementation
- IPC-631: 4U Short Depth Fron tI/O Chassis
- AIMB-705: Industrial ATX Motherboard Supporting 6th/7th Gen. Core i
- PCI-1756: 64-ch Isolated Digital I/O
- PCI CardPCI-1245: DSP-Based 4-Axis Stepping and Servo Motor Control Universal PCI Card
System Diagram

Conclusion
This PCB equipment interconnectivity demonstrates the operation of Advantech’s products as key components in each layer of the system,including data acquisition from the lower layers, transformation of various PLC data formats, and the distributed structure motor control and visual image acquisition; mid-layer computing platform and data integration; and the critical step of cloud data format management and enterprise database integration.
The customer was able to complete a product demonstration in less than a year and then replicate this system in other mass production lines in Shanghai and Tianjin, thus increasing production efficiency via equipment interconnectivity.