MyAdvantech Registration

MyAdvantech is a personalized portal for Advantech customers. By becoming an Advantech member, you can receive latest product news, webinar invitations and special eStore offers.

Sign up today to get 24/7 quick access to your account information.

Advantech Launches Embedded AI Systems and Platforms with Intel® Xeon® D-1700/2700 Processors


January 2022, Taipei, Taiwan - Advantech, a leading provider of IoT solutions, is proud to announce a range of embedded computing solutions featuring Intel® Xeon® D-1700/2700 processors. This range comprises the AIR-500D, the ARK-7060, MIC-790 edge AI servers, and the SOM-5993 COM Express and SOM-D580 COM-HPC server modules. These solutions deliver high computing performance to diverse applications — including those found in machine vision, medical and test equipment, factory automation, AI, and IoT.

AIR-500D — Powerful AI Edge Server

Advantech’s AIR-500D Edge AI server leverages Intel® Xeon® D-1700 series processors with server intelligent management to empower high-end AI inference and training. It supports dual 350W PCIe x16 NVIDIA Quadro and Tesla graphics cards and software tools (CUDA, cuDNN, and TensorRT). AIR-500D features a massive up to 30TB RAID storage capacity via 4 x 2.5” SSDs and 4 x GbE and diverse I/O (4 x RS-232/422/485, 6 x USB 3.0, 1 x 16bit DIO) and M.2 B and E keys for wireless communication and NVMe modules. This solution provides versatile expansion slots for add-on cards (including video codec, 10 GbE and GigE/USB vision frame grabber) and built-in 1200W PSU for heavy CPU/GPU power. AIR-500D is a robust solution with wide operating temperature support (-10 ~ 50 °C; 14 ~ 122 °F), and is an excellent choice for machine automation, robotic AOI, and smart city applications that require a high-performance edge AI server.

ARK-7060 — High-performance Edge Server with IPMI Remote Management

Advantech’s ARK-7060 is a high-performance edge server with multiple expansion slots and fast data transfer speeds that empower AI model training applications. It is equipped with Intel® Xeon® D-1700 series processor and 4 x DDR4 SODIMM sockets that support up to 128GB. ARK-7060 provides slots for PCI, PCIe x4, and PCIe x16 for up to 350W graphics card. Likewise, ARK-7060 supports up to 4 x 2.5” SATA III hard drive bays and delivers high data transfer rates via 10GbE ports and M.2 B key for 5G modules. ARK-7060 onboard BMC provides an IPMI architecture for remote management to enable real-time remote troubleshooting that reduces downtime.

SOM-5993 — Server Grade Rugged COM Express Module with Super Speed I/O 

Advantech’s SOM-5993 is equipped with the latest Intel® Xeon® D-1700 processors. It uses 10 Core and 67W TDP SoC to provide outstanding performance with super speed I/Os including PCIe Gen4 and 10GBASE-KR. Likewise, this COMe module supports up to 128GB ECC/Non-ECC memory for applications necessitating high bandwidth, low latency, and quick data transmission. SOM-5993 also offers TPM, rugged memory, and extended temperature options adaptable to outdoor applications in harsh environments (-40 ~ 85 °C;-40 ~185 °F). In addition, Advantech’s patented thermal solutions enable low noise operation at 100% performance without throttling.

SOM-D580 — COM-HPC Server Module with Super Speed I/O & IPMB RC Ability

Advantech’s SOM-D580 leverages the latest Intel® Xeon® D-2700 processors and is developed with a brand new COM-HPC standard aimed at high-end computing applications. This solution provides up to 20 Cores and 118W TDP SoC. SOM-D580 delivers higher performance and more super speed I/Os than comparable solutions. This COM-HPC module supports up to 512GB ECC/Non-ECC memory and 25GBASE-KR Ethernet to empower edge AI servers, cloud storage, and high-end test equipment. SOM-D580 also offers 32 x lanes PCIe Gen4, 17 x lanes PCIe Gen3, and IPMB. These are suitable for applications requiring diverse expansion and remote control capabilities. Advantech’s patented thermal solutions allow the system to run without throttling and noise at 100% performance.

MIC-790 — Ruggedized, Fanless Edge Server for Edge Cloud Computing Services

MIC-790 is a fanless, ruggedized edge server equipped with the latest Intel® Xeon® D-2700 12 Core processor. MIC-790 supports wide operating temperatures and features a 2U short-depth form factor (-20 ~ 50 °C; -4 ~ 122 °F/350 mm; 13.77 in). MIC-790 can use its multi-core CPU and large memory capacity (up to 192 GB) to process virtual machines and containerized applications. When serving as an edge cloud computing center, MIC-790 benefits cloud to edge networks. It reduces the latency of edge applications dependent upon real-time information and increases data and communications security.


Edge AI Server

  • Intel® Xeon® D-1700 series processor, up to 10 cores 67W
  • Supports dual PCIe x16 350W NVIDIA Quadro and Tesla GPU cards
  • Built-in 1200W power supply CPU/GPU


Edge AI Server

  • Intel® Xeon® D-1700 series processor up to 10 cores 67W
  • Versatile expansion: PCI, PCIex4, PCIex16, M.2 B and M.2 E key
  • Remote management & security: IPMI, dual BIOS, optional TPM2.0


Edge AI Server

  • Intel® Xeon® D-2700 series processor
  • 2 x 10 GbE, 4 x 1GbE, 2 x USB 3.0, 2 x USB 2.0, IPMI, and TPM
  • 2 x NVMe M.2 2280 PCIe Gen3 x4 SSD, 2 x removable 2.5” SATA3 SSD


COM Express Type 7 Basic Module

  • Intel® Xeon® D-1700 processors
  • Dual channel DDR4-3200 SO-DIMM up to 128GB
  • 16 x PCIe Gen 4, 16x PCIe Gen 3, 4 x 10GBASE-KR, 1 x 2.5GbE, 4 x USB 3.2 Gen 1, 2 x SATA 3, and TPM


COM-HPC Server Size D Module

  • Intel® Xeon® D-2700 processors
  • Dual channel DDR4-3200 RDIMM/LRDIMM up to 512GB
  • 32 x PCIe Gen 4, 17 x PCIe Gen 3, 4 x 25GBASE-KR or 8 x 10GBASE-KR, 1 x 2.5GbE, IPMB, 4 x USB 3.2 Gen 1, 2 x SATA 3, and TPM