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High Performance Embedded Box IPC (MIC-7000)

The compact modular PC support i-module expansion to satisfy diverse application requirements. Modular computer reduces lead time for CTOS due to easy configuration and can be widely deployed for factory and machine automation.

Product List

  • MIC-770 V3

    Compact Fanless System with 12th Gen Intel® Core™ i CPU Socket (LGA 1700)

    Preliminary
  • MIC-770 V2

    Compact Fanless System with 10th Gen Intel® Xeon®/Core™ i CPU Socket (LGA 1200)

  • MIC-770

    Compact Fanless System with 8th Gen Intel® Core™ i CPU Socket (LGA 1151)

  • MIC-7420

    Compact Fanless System with Intel® 6th Gen Core™ i Processor

  • MIC-7300

    Compact Fanless System with Intel® Celeron® N3350/Atom™ x7-E3950 Processor

  • MIC-7700

    Intel® 6th/7th Generation Core i Desktop Compact Fanless System

  • MIC-7900

    Intel Xeon Processor Broadwell-DE SoC Compact Fanless System

  • MIC-7500

    Intel 6th Generation Core i Processor Compact Fanless System

  • MIC-790

    Fanless IoT Edge Server with ICE Lake-D Xeon 12 Cores processor, ruggedized fanless and wide temperature (-20~50C) design, up to 192 GB memory

Related Materials

Featured Highlights

  • Fanless Edge PCs for the Industrial IoT Era

    Fanless Edge PCs for the Industrial IoT Era

    To enable the realization of Industry 4.0, field-based edge intelligence is important for developing new IoT applications. Advantech’s MIC-7 series PCs provide high-performance computing, multiple I/O interfaces, and flexible expandability with the integration of i-Modules and iDoor, and can be widely deployed to support various IoT applications.