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Preliminary
-25/AQD-SD3L8GN16-SGW20220627162932.jpg)
/AQD-SD3L8GN16-SGW20220627162942.jpg)
- 30u" Gold Plating Thickness
- Anti-sulfurization resistance
- Samsung original chip
- Wide Temp. -40C to +85C
- 100% tested for stability, compatibility and performance
Product Specifications Download Spec
- Part Number
- Details
-
AQD-SD3L8GN16-SGW
- Manufacturer
- Capacity
- Chip Manufacturer
- Chip Organization
- Rank
- Interface
- Frequency
- Voltage
- PCB Height
- Feature
- Operating Temperature
- Advantech
- 8 GB
- SAMSUNG
- 512M X 8
- 2 Rank
- 204 pin
- 1600 Mhz
- 1.35 V
- 1.18"
- Unbuffered
- -40 ~ 85°C (-40 ~ 185°F)
Memory
-
Manufacturer
AQD-SD3L8GN16-SGW Advantech -
Capacity
AQD-SD3L8GN16-SGW 8 GB -
Chip Manufacturer
AQD-SD3L8GN16-SGW SAMSUNG -
Chip Organization
AQD-SD3L8GN16-SGW 512M X 8 -
Rank
AQD-SD3L8GN16-SGW 2 Rank -
Interface
AQD-SD3L8GN16-SGW 204 pin -
Frequency
AQD-SD3L8GN16-SGW 1600 Mhz -
Voltage
AQD-SD3L8GN16-SGW 1.35 V -
PCB Height
AQD-SD3L8GN16-SGW 1.18" -
Feature
AQD-SD3L8GN16-SGW Unbuffered -
Operating Temperature
AQD-SD3L8GN16-SGW -40 ~ 85°C (-40 ~ 185°F)
