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TPC-107W

搭載ARM Cortex™-A53處理器的7吋觸控面板電腦

  • NXP® ARM® Cortex™-A53 i.MX 8M Mini四核處理器
  • 7吋16:9多點觸控P-CAP和true-flatIP66等級前面板液晶顯示器
  • 最高2 GB DDR4 RAM和16 GB eMMC內建儲存空間
  • 2個10/100/1000 Mbps LAN埠,可選配IEEE 802.3at/af PoE-PD模組支援
  • 1 mb FRAM備份記憶體,以應對意外斷電
  • 2個串列埠,帶有120Ω終端電阻,其中一個支援CAN 2.0B協議,並提供可編程的位元速率高達1 Mb/sec
  • 內建瀏覽器,用於快速的Web應用程式開發
  • 支援Linux Yocto和Android
  • 可選配mPCIe擴充模組

認證:

規格

Touchscreen
Touch Type
  • PCAP
  • PCAP
LCD Display
Display Size
  • 7"
  • 7"
Max. Resolution
  • 1024 x 600
  • 1024 x 600
Luminance (cd/m2)
  • 425
  • 425
Backlight Life (hrs)
  • 50,000
  • 50,000
Hardware
CPU
  • NXP® ARM® Cortex™ A53 i.MX8M 1.6 GHz Quad-Core
  • NXP® ARM® Cortex™ A53 i.MX8M 1.6 GHz Quad-Core
Memory
  • 1 x LPDDR4 with 4 GB
  • 1 x LPDDR4 with 4 GB
Storage
  • 1 x eMMC (16 GB), 1 x micro SD Slot
  • 1 x eMMC (16 GB), 1 x micro SD Slot
Expansion
  • 1 x M.2 E Key 2230
  • 1 x M.2 E Key 2230
Certification
  • CB, UL, CE, FCC Class A, CCC, BSMI
  • CB, UL, CE, FCC Class A, CCC, BSMI
OS Support
  • Linux Yocto
  • Android
Power Input
  • 24 VDC ±20%
  • 24 VDC ±20%
I/O Interface
USB Ports
  • 2 x USB 2.0
  • 2 x USB 2.0
LAN Ports
  • 2 x 10/100/1000 Mbps
  • 2 x 10/100/1000 Mbps
Serial Ports
  • 1xRS-232/422/485,1xRS-485/Canbus
  • 1xRS-232/422/485,1xRS-485/Canbus
Mechanical
Enclosure
  • Die cast magnesium alloy, Die-casting aluminum
  • Die cast magnesium alloy, Die-casting aluminum
Mounting
  • VESA, Panel
  • VESA, Panel
Weight (Net)
  • 2 kg (4.41 lb)
  • 2 kg (4.41 lb)
Environment
Ingress Protection
  • Front Panel IP66
  • Front Panel IP66
Operating Temperature
  • -20~60 °C (-4~140 °F)
  • -20~60 °C (-4~140 °F)
Storage Temperature
  • -30~70 °C (-22~158 °F)
  • -30~70 °C (-22~158 °F)
Relative Humidity
  • 95% RH (non-condensing)
  • 95% RH (non-condensing)
Shock Protection
  • 10 G, half sine
  • 10 G, half sine
Vibration Protection
  • 2 Grms, random
  • 2 Grms, random
Isolation Protection
  • Chassis grounding protection
  • Chassis grounding protection