Advantech Demonstrates Physical AI and Real-Time Edge Intelligence for Next-Generation Semiconductor Equipment at SEMICON Taiwan 2026

Advantech (TWSE: 2395), a global leader in intelligent systems and embedded platforms, will demonstrate technologies designed to improve the precision, responsiveness, and autonomy of semiconductor equipment at SEMICON Taiwan 2026, held September 2–4 at the Taipei Nangang Exhibition Center. Under the theme “Enabling Advanced Semiconductor Equipment with Real-Time Edge Intelligence,” Advantech will present solutions for inspection and metrology, wafer fab equipment, advanced packaging, and robotics at the Smart Manufacturing Pavilion, TaiNEX Hall 2, 1F, Booth Q5637.

“Every generation of semiconductor manufacturing has demanded greater precision and speed from equipment. What's different today is that AI makes it possible to build machines that truly learn and adapt — not just execute. Edge AI brings that intelligence directly into the machine's control loop, where milliseconds matter. Physical AI goes further, enabling equipment to perceive, reason, and act autonomously " said Linda Tsai, President, Intelligent System Sector & COO, Advantech.

1. Inspection & Metrology：Advantech will showcase high-performance computing and machine vision solutions featuring edge computing, high-speed CoaXPress image acquisition, and all-in-one CamFlow vision software — enabling equipment builders to streamline vision system development and efficiently process large volumes of high-resolution inspection data with significantly reduced latency. The showcase will also feature SKYRack SEMI, a SEMI S2-certified rack integrating safety, monitoring, power management, and flexible cooling for high-performance semiconductor equipment.

2. Wafer Fab Equipment：Advantech will demonstrate digital twin and real-time control technologies to accelerate equipment development. By integrating CODESYS-based EtherCAT control with NVIDIA Omniverse libraries and NVIDIA Isaac Sim, engineers can validate control logic in a physics-accurate virtual environment before hardware is ready, reducing development risks and shortening equipment development cycles. 

3. Advanced Packaging：Advantech will showcase a GPU-powered DAQ system combining high-speed data acquisition, GPU acceleration, and real-time AI processing. GPUDirect zero-copy streaming transfers data directly from DAQ to GPU memory, reducing CPU overhead. Paired with the NVIDIA CUDA-integrated DAQNavi SDK, the platform converts massive production data into real-time AI decisions for faster process optimization and improved yield.

Advantech will also demonstrate a Physical AI and robotics architecture that combines sensing, edge computing, AI, functional safety, and robotic systems to support more autonomous manufacturing. Live demonstrations will include autonomous mobile robots (AMRs) featuring real-time Edge AI. The showcase will also feature Advantech’s AI Factory Brain, which applies Agentic AI to help manufacturing systems move beyond rigid factory automation toward autonomous decision-making.

Advantech Executive Keynote at the Heterogeneous Integration Global Summit 

 Advantech will further address the industry’s transition toward intelligent and autonomous semiconductor manufacturing at the Heterogeneous Integration Global Summit on September 4. Linda Tsai, President, Intelligent System Sector & COO, Advantech, will deliver a keynote titled “Advancing Semiconductor Manufacturing with Real-Time Edge AI and Robotics.” Her presentation will examine how Edge AI, Physical AI, and AI digital twins are converging to accelerate equipment development and enable more responsive manufacturing, as well as the implications for equipment builders, chipmakers, and supply-chain partners. The session will take place from 9:00 to 9:25 AM at the New Palace Grande Luxe Banquet in Nangang, Taipei.